ZHCSNO7 March 2021 TPS62865 , TPS62867
PRODUCTION DATA
After the layout recommendations for component placement and routing have been followed, the PCB design must focus on thermal performance. Thermal design is important and must be considered to remove the heat generated in the device during operation. The device junction temperature must stay below its maximum rated temperature of 125°C for correct operation.
Use wide traces and planes, especially to the PGND, VIN, and VOUT pins, and use vias to internal planes to improve the power dissipation capability of the design. If the application allows it, use airflow in the system to further improve cooling.
The Thermal Information table provides the thermal parameters of the device and its package based on the JEDEC standard 51-7. See the Semiconductor and IC Package Thermal Metrics application report for a detailed explanation of each parameter. In addition to the JEDEC standard, the thermal information table also contains the thermal parameters of the EVM. The EVM better reflects a real-world PCB design with thicker traces connecting to the device.