ZHCSJW0D June 2019 – March 2020 TPS62840
PRODUCTION DATA.
| THERMAL METRIC(1) | 8 Pins DLC Package | 6 Pins YBG Package | 8 Pins DGR Package | DGR EVM | UNIT | |
|---|---|---|---|---|---|---|
| JEDEC PCB 51-7 | JEDEC PCB 51-5 | TPS62841-2EVM123 | ||||
| RθJA | Junction-to-ambient thermal resistance | 105.6 | 133.4 | 54.4 | 46.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 75.7 | 0.4 | 58.1 | N/A | °C/W |
| RθJB | Junction-to-board thermal resistance | 31.9 | 39.4 | 25.9 | N/A | °C/W |
| ψJT | Junction-to-top characterization parameter | 2.3 | 0.1 | 1.2 | 0.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 31.5 | 39.4 | 25.9 | 17.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | 11.7 | N/A | °C/W |