SLVSC52B July 2013 – September 2015 TPS62152-Q1
PRODUCTION DATA.
| PIN(1) | TYPE(2) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| AGND | 6 | G | Analog ground. Connected AGND directly to the exposed thermal pad and common ground plane. |
| AVIN | 10 | S | Supply voltage for control circuitry. Connect to the same source as PVIN. |
| DEF | 8 | I | Output voltage scaling (Low = nominal, High = nominal + 5%)(4) |
| EN | 13 | I | Enable input (High = enabled, Low = disabled)(4) |
| FB | 5 | I | TI recommends connecting FB to AGND for improved thermal performance. |
| FSW | 7 | I | Switching frequency select (Low ≈ 2.5 MHz, High ≈ 1.25 MHz(3) for typical operation)(4) |
| PG | 4 | O | Output power good (High = VOUT ready, Low = VOUT below nominal regulation); open drain (requires pullup resistor; goes high-impedance when device is switched off) |
| PGND | 15 | G | Power ground. Must be connected directly to the exposed thermal pad and common ground plane. |
| 16 | |||
| PVIN | 11 | S | Supply voltage for power stage. Connect to same source as AVIN. |
| 12 | |||
| SS/TR | 9 | I | Soft-start or tracking pin. An external capacitor connected to this pin sets the internal voltage-reference rise time. The pin can be used for tracking and sequencing. |
| SW | 1 | O | Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and output capacitor. |
| 2 | |||
| 3 | |||
| VOS | 14 | I | Output-voltage sense pin and connection for the control-loop circuitry. |
| Exposed thermal pad | — | Connect to AGND (pin 6), PGND (pins 15,16) and common ground plane(5). Solder to PCB to achieve appropriate power dissipation and mechanical reliability. | |