ZHCS247C May 2011 – April 2018 TPS61260 , TPS61261
PRODUCTION DATA.
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
For more details on how to use the thermal parameters in the dissipation ratings table, please check the Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs Application Report (SZZA017) and the Semiconductor and IC Package Thermal Metrics Application Report (SPRA953).