ZHCSJL1C September 2010 – April 2019 TPS61251
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 說明 （續(xù)）
- 6 Device Options
- 7 Pin Configuration and Functions
- 8 Specifications
- 9 Detailed Description
- 10Application and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13器件和文檔支持
- 14機械、封裝和可訂購信息
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- DSG|8
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- DSG|8
訂購信息
7 Pin Configuration and Functions
DSG Package
8-Pin WSON
Top View
Pin Functions
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| EN | 6 | I | Enable input (1 enabled, 0 disabled) |
| FB | 3 | I | Voltage feedback pin |
| GND | 1 | Ground | |
| ILIM | 4 | I | Adjustable average input current limit. Can be connected to VIN for maximum current limit or to GND for minimum current limit. |
| PG | 5 | O | Output power good (1 good, 0 failure; open drain) |
| SW | 7 | I | Connection for Inductor |
| VIN | 8 | I | Supply voltage for power stage |
| VOUT | 2 | O | Boost converter output |
| Exposed Thermal Pad | Must be soldered to achieve appropriate power dissipation and for mechanical reasons. Must be connected to GND. | ||