ZHCSIC0A September 2018 – November 2018 TPS61088-Q1
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 （說明 （續））
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機械、封裝和可訂購信息
11.3 Thermal Considerations
The maximum IC junction temperature should be restricted to 125°C under normal operating conditions. Calculate the maximum allowable dissipation, PD(max), and keep the actual power dissipation less than or equal to PD(max). The maximum-power-dissipation limit is determined using Equation 21.
where
- TA is the maximum ambient temperature for the application.
- RθJA is the junction-to-ambient thermal resistance given in the Thermal Information table.
The TPS61088-Q1 comes in a thermally-enhanced VQFN package. This package includes a thermal pad that improves the thermal capabilities of the package. The real junction-to-ambient thermal resistance of the package greatly depends on the PCB type, layout, and thermal pad connection. Using thick PCB copper and soldering the thermal pad to a large ground plate enhance the thermal performance. Using more vias connects the ground plate on the top layer and bottom layer around the IC without solder mask also improves the thermal capability.