ZHCSMU8C March 2020 – July 2021 TPS54JA20
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Internal VCC LDO And Using External Bias On VCC Pin
- 7.3.2 Enable
- 7.3.3 Output Voltage Setting
- 7.3.4 Internal Fixed Soft Start and External Adjustable Soft Start
- 7.3.5 External REFIN For Output Voltage Tracking
- 7.3.6 Frequency and Operation Mode Selection
- 7.3.7 D-CAP3 Control
- 7.3.8 Low-side FET Zero-Crossing
- 7.3.9 Current Sense and Positive Overcurrent Protection
- 7.3.10 Low-side FET Negative Current Limit
- 7.3.11 Power Good
- 7.3.12 Overvoltage and Undervoltage Protection
- 7.3.13 Out-Of-Bounds (OOB) Operation
- 7.3.14 Output Voltage Discharge
- 7.3.15 UVLO Protection
- 7.3.16 Thermal Shutdown
- 7.4 Device Functional Modes
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2
Detailed Design Procedure
- 8.2.2.1 Output Voltage Setting Point
- 8.2.2.2 Choose the Switching Frequency and the Operation Mode
- 8.2.2.3 Choose the Inductor
- 8.2.2.4 Set the Current Limit (TRIP)
- 8.2.2.5 Choose the Output Capacitor
- 8.2.2.6 Choose the Input Capacitors (CIN)
- 8.2.2.7 Soft Start Capacitor (SS/REFIN Pin)
- 8.2.2.8 EN Pin Resistor Divider
- 8.2.2.9 VCC Bypass Capacitor
- 8.2.2.10 BOOT Capacitor
- 8.2.2.11 PGOOD Pullup Resistor
- 8.2.3 Application Curves
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RWW|21
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
11.5 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |