ZHCSEX9D March 2016 – July 2017 TPS548D22
PRODUCTION DATA.
Consider these layout guidelines before starting a layout work using TPS548D22.
Figure 25. EVM Top View
Figure 27. EVM Inner Layer 1
Figure 29. EVM Inner Layer 3
Figure 31. EVM Bottom Layer
Figure 26. EVM Top Layer
Figure 28. EVM Inner Layer 2
Figure 30. EVM Inner Layer 4
Proper mounting technique adequately covers the exposed thermal tab with solder. Excessive heat during the reflow process can affect electrical performance. Figure 32 shows the recommended reflow oven thermal profile. Proper post-assembly cleaning is also critical to device performance. See the Application Report, QFN/SON PCB Attachment, (SLUA271) for more information.
Figure 32. Recommended Reflow Oven Thermal Profile
| PARAMETER | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| RAMP UP AND RAMP DOWN | |||||
| rRAMP(up) | Average ramp-up rate, TS(max) to TP | 3 | °C/s | ||
| rRAMP(down) | Average ramp-down rate, TP to TS(max) | 6 | °C/s | ||
| PRE-HEAT | |||||
| TS | Pre-heat temperature | 150 | 200 | °C | |
| tS | Pre-heat time, TS(min) to TS(max) | 60 | 180 | s | |
| REFLOW | |||||
| TL | Liquidus temperature | 217 | °C | ||
| TP | Peak temperature | 260 | °C | ||
| tL | Time maintained above liquidus temperature, TL | 60 | 150 | s | |
| tP | Time maintained within 5°C of peak temperature, TP | 20 | 40 | s | |
| t25P | Total time from 25°C to peak temperature, TP | 480 | s | ||