7.6 Dissipation Ratings(2)(1)
| PACKAGE |
THERMAL IMPEDANCE JUNCTION-TO-AMBIENT |
TA = 25°C
POWER RATING |
TA = 70°C
POWER RATING |
TA = 85°C
POWER RATING |
| 28 Pin PWP with solder |
18.2 °C/W |
5.49(3) W |
3.02 W |
2.20 W |
| 28 Pin PWP without solder |
40.5 °C/W |
2.48 W |
1.36 W |
0.99 W |
(1) Thermal metrics shown in
Thermal Information refer to JEDEC High K board. Metrics in this table refer to the test board conditions listed below.
(2) Test board conditions:
- 3 inch × 3 inch, 4 layers, thickness: 0.062 in
- 1.5 oz. copper traces located on the top of the PCB
- 1.5 oz. copper plane located on the bottom of the PCB
- 0.5 oz. copper planes on the 2 inner layers
- 12 thermal vias. See Figure 23
(3) Maximum power dissipation may be limited by overcurrent protection