ZHCSG03A December 2016 – January 2017 TPS54260-EP
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用范圍
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Fixed Frequency PWM Control
- 7.3.2 Slope Compensation Output Current
- 7.3.3 Pulse Skip Eco-mode Control Scheme
- 7.3.4 Low Dropout Operation and Bootstrap Voltage (Boot)
- 7.3.5 Error Amplifier
- 7.3.6 Voltage Reference
- 7.3.7 Adjusting the Output Voltage
- 7.3.8 Enable and Adjusting Undervoltage Lockout (UVLO)
- 7.3.9 Slow-Start and Tracking Pin (SS/TR)
- 7.3.10 Overload Recovery Circuit
- 7.3.11 Constant Switching Frequency and Timing Resistor (RT and CLK Pin)
- 7.3.12 Overcurrent Protection and Frequency Shift
- 7.3.13 Selecting the Switching Frequency
- 7.3.14 How to Interface to RT/CLK Pin
- 7.3.15 Power Good (PWRGDPin)
- 7.3.16 Overvoltage Transient Protection (OVTP)
- 7.3.17 Thermal Shutdown
- 7.3.18 Small Signal Model for Loop Response
- 7.3.19 Simple Small-Signal Model for Peak Current Mode Control
- 7.3.20 Small-Signal Model for Frequency Compensation
- 7.4 Device Functional Modes
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2
Detailed Design Procedure
- 8.2.2.1 Selecting The Switching Frequency
- 8.2.2.2 Output Inductor Selection (LO)
- 8.2.2.3 Output Capacitor
- 8.2.2.4 Catch Diode
- 8.2.2.5 Input Capacitor
- 8.2.2.6 Slow-Start Capacitor
- 8.2.2.7 Bootstrap Capacitor Selection
- 8.2.2.8 UVLO Set Point
- 8.2.2.9 Output Voltage and Feedback Resistors Selection
- 8.2.2.10 Compensation
- 8.2.2.11 Discontinuous Mode and Eco-mode Control Scheme Boundary
- 8.2.2.12 Power Dissipation
- 8.2.3 Application Curves
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購信息
封裝選項
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
10 Layout
10.1 Layout Guidelines
Layout is a critical portion of good power supply design. There are several signals paths that conduct fast changing currents or voltages that can interact with stray inductance or parasitic capacitance to generate noise or degrade the power supplies performance. To help eliminate these problems, the VIN pin should be bypassed to ground with a low ESR ceramic bypass capacitor with X5R or X7R dielectric. Care should be taken to minimize the loop area formed by the bypass capacitor connections, the VIN pin, and the anode of the catch diode. See Figure 59 for a PCB layout example. The GND pin should be tied directly to the power pad under the IC and the power pad.
The power pad should be connected to any internal PCB ground planes using multiple vias directly under the IC. The PH pin should be routed to the cathode of the catch diode and to the output inductor. Because the PH connection is the switching node, the catch diode and output inductor should be located close to the PH pins, and the area of the PCB conductor minimized to prevent excessive capacitive coupling. For operation at full rated load, the top side ground area must provide adequate heat dissipating area. The RT/CLK pin is sensitive to noise so the RT resistor should be located as close as possible to the IC and routed with minimal lengths of trace. The additional external components can be placed approximately as shown. It may be possible to obtain acceptable performance with alternate PCB layouts, however this layout has been shown to produce good results and is meant as a guideline.
10.1.1 Estimated Circuit Area
The estimated printed circuit board area for the components used in the design of Figure 46 is 0.55 in2. This area does not include test points or connectors.
10.2 Layout Example
This layout example is shown for the HVSSOP (DGQ) package. The VSON (DRC) package can also use this layout example because the pin assignments on the VSON package are the same as the HVSSOP package.
Figure 59. PCB Layout Example