SLUS772G March 2008 – June 2020 TPS40210 , TPS40211
PRODUCTION DATA
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Soft Start
- 7.3.2 BP Regulator
- 7.3.3 Shutdown (DIS/ EN Pin)
- 7.3.4 Minimum On-Time and Off-Time Considerations
- 7.3.5 Setting the Oscillator Frequency
- 7.3.6 Synchronizing the Oscillator
- 7.3.7 Current Sense and Overcurrent
- 7.3.8 Current Sense and Subharmonic Instability
- 7.3.9 Current Sense Filtering
- 7.3.10 Control Loop Considerations
- 7.3.11 Gate Drive Circuit
- 7.3.12 TPS40211
- 7.4 Device Functional Modes
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Applications
- 8.2.1
12-V to 24-V Nonsynchronous Boost Regulator
- 8.2.1.1 Design Requirements
- 8.2.1.2
Detailed Design Procedure
- 8.2.1.2.1 Custom Design with WEBENCH Tools
- 8.2.1.2.2 Duty Cycle Estimation
- 8.2.1.2.3 Inductor Selection
- 8.2.1.2.4 Rectifier Diode Selection
- 8.2.1.2.5 Output Capacitor Selection
- 8.2.1.2.6 Input Capacitor Selection
- 8.2.1.2.7 Current Sense and Current Limit
- 8.2.1.2.8 Current Sense Filter
- 8.2.1.2.9 Switching MOSFET Selection
- 8.2.1.2.10 Feedback Divider Resistors
- 8.2.1.2.11 Error Amplifier Compensation
- 8.2.1.2.12 RC Oscillator
- 8.2.1.2.13 Soft-Start Capacitor
- 8.2.1.2.14 Regulator Bypass
- 8.2.1.2.15 Bill of Materials
- 8.2.1.3 Application Curves
- 8.2.2 12-V Input, 700-mA LED Driver, Up to 35-V LED String
- 8.2.1
12-V to 24-V Nonsynchronous Boost Regulator
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數據表獲取器件具體的封裝圖。
機械數據 (封裝 | 引腳)
- DRC|10
- DGQ|10
散熱焊盤機械數據 (封裝 | 引腳)
訂購信息
11.7 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |