ZHCSS26F november 1998 – october 2020
PRODUCTION DATA
| THERMAL METRIC(1) | TPS3705-xx | TPS3707-xx | UNIT | |
|---|---|---|---|---|
| D (SOIC) | DGN (MSOP-PowerPAD) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 118.2 | 66.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 64.4 | 62.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 58.5 | 45.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 15.8 | 7.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 57.9 | 44.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | 18.5 | °C/W |