ZHCSFF5G July 2016 – December 2019 TPS2660
PRODUCTION DATA.
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TPS2660 | UNIT | ||
|---|---|---|---|---|
| PWP (HTSSOP) | RHF (VQFN) | |||
| 16 PINS | 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 38.6 | 30.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 22.7 | 20.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 18.2 | 7.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.5 | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 18 | 7.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.5 | 1.7 | °C/W |