ZHCSMU5A July 2020 – December 2020 TPS25814
PRODUCTION DATA
The TPS25814 features a central thermal shutdown as well as independent thermal sensors for each internal power path. The central thermal shutdown monitors the overall temperature of the die and disables all functions except for supervisory circuitry when die temperature goes above a rising temperature of TSD_MAIN. The temperature shutdown has a hysteresis of TSDH_MAIN and when the temperature falls back below this value, the device resumes normal operation.
The power path thermal shutdown monitors the temperature of each internal PP5V-to-VBUS power path and disables both power paths and the VCONN power path when either exceeds TSD_PP5V. Once the temperature falls by at least TSDH_PP5V the path can be configured to resume operation or remain disabled until re-enabled by firmware.