SLVS841F November 2008 – August 2016 TPS2552 , TPS2552-1 , TPS2553 , TPS2553-1
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Parameter Measurement Information
- 9 Detailed Description
- 10Application and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數據表獲取器件具體的封裝圖。
機械數據 (封裝 | 引腳)
- DBV|6
- DRV|6
散熱焊盤機械數據 (封裝 | 引腳)
- DRV|6
訂購信息
12 Layout
12.1 Layout Guidelines
- TI recommends placing the 100-nF bypass capacitor near the IN and GND pins, and make the connections using a low-inductance trace.
- TI recommends placing a high-value electrolytic capacitor and a 100-nF bypass capacitor on the output pin when large transient currents are expected on the output.
- The traces routing the RILIM resistor to the device must be as short as possible to reduce parasitic effects on the current limit accuracy.
- The PowerPAD must be directly connected to PCB ground plane using wide and short copper trace.
12.2 Layout Example
Figure 30. Layout Recommendation