ZHCSGA2A May 2017 – May 2018 TPL7407LA
PRODUCTION DATA.
| THERMAL METRIC(1) | TPL7407LA | UNIT | ||
|---|---|---|---|---|
| TSSOP (PW) | SOIC (D) | |||
| 16 PINS | 16 PINS | |||
| θJA | Junction-to-ambient thermal resistance | 113.1 | 88 | °C/W |
| θJCtop | Junction-to-case (top) thermal resistance | 46.5 | 47.6 | °C/W |
| θJB | Junction-to-board thermal resistance | 58.6 | 45.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 7 | 14.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 58 | 45.3 | °C/W |