over operating free-air temperature range (unless otherwise noted) (1) | MIN | MAX | UNIT |
|---|
| VCC | Supply voltage | –0.3 | 5.5 | V |
| VIO | Input/output voltage | –0.3 | VCC + 0.3 | V |
| Bump temperature (soldering) | Infrared (15 s) | | 220 | °C |
| Vapor phase (60 s) | | 215 |
| Lead temperature (soldering, 10 s) | | 300 | °C |
| TJ | Junction temperature | | 150 | °C |
| Tstg | Storage temperature | –65 | 150 | °C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause
permanent damage to the device. These are stress ratings only, which do not
imply functional operation of the device at these or any other conditions beyond
those indicated under Recommended Operating Conditions. Exposure to
absolute-maximum-rated conditions for extended periods may affect device
reliability.