ZHCSHB1B January 2018 – August 2018 TPA3220
PRODUCTION DATA.
| THERMAL METRIC(1) | TPA3220 | UNIT | |
|---|---|---|---|
| DDW 44-PINS HTSSOP | |||
| JEDEC STANDARD 4 LAYER PCB | |||
| RθJA | Junction-to-ambient thermal resistance | 23.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 11.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 4.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 4.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.1 | °C/W |