ZHCSE21A July 2015 – August 2015 TPA3116D2-Q1 , TPA3118D2-Q1
PRODUCTION DATA.
- 1 特性
- 2 應用范圍
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
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7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Gain Setting and Master and Slave
- 7.3.2 Input Impedance
- 7.3.3 Start-Up and Shutdown Operation
- 7.3.4 PLIMIT Operation
- 7.3.5 GVDD Supply
- 7.3.6 BSPx and BSNx Capacitors
- 7.3.7 Differential Inputs
- 7.3.8 Device Protection System
- 7.3.9 DC-Detect Protection
- 7.3.10 Short-Circuit Protection and Automatic Recovery Feature
- 7.3.11 Thermal Protection
- 7.3.12 TPA311xD2-Q1 Modulation Scheme
- 7.3.13 AM Avoidance EMI Reduction
- 7.4 Device Functional Mode
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機械、封裝和可訂購信息
11 器件和文檔支持
11.1 器件支持
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 相關鏈接
以下表格列出了快速訪問鏈接。 范圍包括技術文檔、支持與社區資源、工具和軟件，并且可以快速訪問樣片或購買鏈接。
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
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TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
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Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
11.3 商標
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 靜電放電警告
ESD 可能會損壞該集成電路。德州儀器 (TI) 建議通過適當的預防措施處理所有集成電路。如果不遵守正確的處理措施和安裝程序 , 可能會損壞集成電路。
ESD 的損壞小至導致微小的性能降級 , 大至整個器件故障。 精密的集成電路可能更容易受到損壞 , 這是因為非常細微的參數更改都可能會導致器件與其發布的規格不相符。
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.