SLOS528F July 2009 – April 2017 TPA3110D2
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and F unctions
- 7 Specifications
- 8 Parameter Measurement Information
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9 Detailed Description
- 9.1 Overview
- 9.2 Functional Block Diagram
- 9.3 Feature Description
- 9.4 Device Functional Modes
- 10Application and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
封裝選項
機械數據 (封裝 | 引腳)
- PWP|28
散熱焊盤機械數據 (封裝 | 引腳)
- PWP|28
訂購信息
13 Device and Documentation Support
13.1 Device Support
13.2 Documentation Support
13.2.1 Related Documentation
For related documentation see the following:
- Application Report, PowerPAD™ Thermally Enhanced Package, SLMA002
- Application Report, Using Thermal Calculation Tools for Analog Components, SLUA566
- Application Report, AN-1737 Managing EMI in Class D Audio Applications, SNAA050
- Application Report, AN-1849 An Audio Amplifier Power Supply Design, SNAA057
- Application Report, Guidelines for Measuring Audio Power Amplifier Performance, SLOA068
- User's Guide, TPA3110D2 EVM Audio Amplifier Evaluation Board SLOU263
13.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
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TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
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Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
13.4 Trademarks
SpeakerGuard, PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
13.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
13.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.