ZHCSQE5C April 2022 – February 2024 TMUX6236
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Thermal Information
- 5.4 Recommended Operating Conditions
- 5.5 Source or Drain Continuous Current
- 5.6 ±15V Dual Supply: Electrical Characteristics?
- 5.7 ±15V Dual Supply: Switching Characteristics?
- 5.8 36V Single Supply: Electrical Characteristics?
- 5.9 36V Single Supply: Switching Characteristics?
- 5.10 12V Single Supply: Electrical Characteristics?
- 5.11 12V Single Supply: Switching Characteristics?
- 5.12 ±5V Dual Supply: Electrical Characteristics?
- 5.13 ±5V Dual Supply: Switching Characteristics?
- 5.14 Typical Characteristics
-
6 Parameter Measurement Information
- 6.1 On-Resistance
- 6.2 Off-Leakage Current
- 6.3 On-Leakage Current
- 6.4 Transition Time
- 6.5 tON(EN) and tOFF(EN)
- 6.6 Break-Before-Make
- 6.7 tON (VDD) Time
- 6.8 Propagation Delay
- 6.9 Charge Injection
- 6.10 Off Isolation
- 6.11 Crosstalk
- 6.12 Bandwidth
- 6.13 THD + Noise
- 6.14 Power Supply Rejection Ratio (PSRR)
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數據表獲取器件具體的封裝圖。
機械數據 (封裝 | 引腳)
- PW|16
- RUM|16
散熱焊盤機械數據 (封裝 | 引腳)
- RUM|16
訂購信息
4 Pin Configuration and Functions
Figure 4-1 RUM Package,16-Pin WQFN(Top View)Figure 4-2 PW
Package,16-Pin TSSOP(Top View)
Table 4-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | TSSOP | WQFN | ||
| D1 | 3 | 1 | I/O | Drain pin. Can be an input or output. |
| D2 | 11 | 9 | I/O | Drain pin. Can be an input or output. |
| EN | 14 | 12 | I | Active high logic enable, has internal pull-up resistor. When this pin is low, all switches are turned off. When this pin is high, the SEL logic input determine which switch is turned on. |
| GND | 6 | 4 | P | Ground (0V) reference |
| NC |
7, 8, 15, 16 |
5, 7, 13, 14 | — | No internal connection. Can be shorted to GND or left floating. |
| S1A |
2 |
16 | I/O | Source pin 1A. Can be an input or output. |
| S1B |
4 |
2 | I/O | Source pin 1B. Can be an input or output. |
| S2A | 10 |
8 | I/O | Source pin 2A. Can be an input or output. |
| S2B | 12 |
10 | I/O | Source pin 2B. Can be an input or output. |
| SEL1 | 1 | 15 | I | Logic control input, has internal pull-down resistor. Table 7-1 lists how to control the switch connection. |
| SEL2 | 9 | 6 | I | Logic control input, has internal pull-down resistor. Table 7-1 lists how to control the switch connection. |
| VDD | 13 | 11 | P | Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1μF to 10μF between VDD and GND. |
| VSS | 5 | 3 | P | Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1μF to 10μF between VSS and GND. |
| Thermal Pad | — | The thermal pad is not connected internally. There is no requirement to electrically connect this pad. If connected, however, it is recommended that the pad be left floating or tied to GND. | ||
(1) I = input, O = output, P = power