ZHCSJE1C February 2019 – December 2023 TMUX1111 , TMUX1112 , TMUX1113
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Device Comparison Table
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics (VDD = 5V ±10 %)
- 6.6 Electrical Characteristics (VDD = 3.3V ±10 %)
- 6.7 Electrical Characteristics (VDD = 1.8V ±10 %)
- 6.8 Electrical Characteristics (VDD = 1.2V ±10 %)
- 6.9 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Device and Documentation Support
- 11Revision History
- 12Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PW|16
- RSV|16
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RSV|16
訂購信息
7.5 Break-before-make
The TMUX1113 has break-before-make delay which allows the device to be used in cross-point switching application. The output first breaks from the on-state switch before making the connection with the next on-state switch. The time delay between the break and the make is known as break-before-make delay. Figure 7-5 shows the setup used to measure break-before-make delay, denoted by the symbol tOPEN(BBM).
Figure 7-5 Break-Before-Make Delay
Measurement Setup