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ZHCSDW3B June 2015 – August 2016 TMP461

PRODUCTION DATA.

封裝選項

機械數據 (封裝 | 引腳)

RUN|10
- MPQF225C

散熱焊盤機械數據 (封裝 | 引腳)

RUN|10
- QFND329A

訂購信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

		MIN	MAX	UNIT
Power supply	V+	–0.3	6	V
Input voltage	THERM, ALERT/THERM2, SDA and SCL only	–0.3	6	V
	D+, A0, A1	–0.3	(V+) + 0.3
	D– only	–0.3	0.3
Input current			10	mA
Operating temperature		–55	150	°C
Junction temperature (T_J max)			150	°C
Storage temperature, T_stg		–60	150	°C

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

7.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged device model (CDM), JEDEC specification JESD22-C101⁽²⁾	±1000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

		MIN	NOM	MAX	UNIT
V+	Supply voltage	1.7	3.3	3.6	V
T_A	Operating free-air temperature	–40		125	°C

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		TMP461	UNIT
		RUN (WQFN)
		10 PINS
R_θJA	Junction-to-ambient thermal resistance	123.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	60.1	°C/W
R_θJB	Junction-to-board thermal resistance	78.1	°C/W
ψ_JT	Junction-to-top characterization parameter	4.6	°C/W
ψ_JB	Junction-to-board characterization parameter	78.1	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

At T_A = –40°C to 125°C and V+ = 1.7 V to 3.6 V, unless otherwise noted.

PARAMETER			CONDITIONS	MIN	TYP	MAX	UNIT
TEMPERATURE MEASUREMENT
TA_LOCAL	Local temperature sensor accuracy		T_A = –10°C to 100°C, V+ = 1.7 V to 3.6 V	-1	±0.125	+1	°C
TA_LOCAL	Local temperature sensor accuracy		T_A = –40°C to 125°C, V+ = 1.7 V to 3.6 V	-1.25	±0.5	+1.25	°C
TA_REMOTE	Remote temperature sensor accuracy		T_A = 0°C to 100°C, T_D = –55°C to 150°C, V+ = 1.7 V to 3.6 V	-0.75	±0.125	+ 0.75	°C
TA_REMOTE	Remote temperature sensor accuracy		T_A = –40°C to 125°C, T_D = –55°C to 150°C, V+ = 1.7 V to 3.6 V	-1.5	±0.5	+1.5	°C
	Temperature sensor error versus supply (local or remote)		V+ = 1.7 V to 3.6 V	-0.25	±0.1	+0.25	°C/V
	Temperature resolution (local and remote)				0.0625		°C
	ADC conversion time		One-shot mode, per channel (local or remote)		15	17	ms
	ADC resolution				12		Bits
	Remote sensor source current	High	Series resistance 1 kΩ (max)	88	120	152	µA
		Medium		33	45	57
		Low		5.5	7.5	9.5
η	Remote transistor ideality factor		TMP461 optimized ideality factor		1.008
SERIAL INTERFACE
V_IH	High-level input voltage			1.4			V
V_IL	Low-level input voltage					0.45	V
	Hysteresis				200		mV
	SDA output-low sink current			6			mA
V_OL	Low-level output voltage		I_O = –6 mA		0.15	0.4	V
	Serial bus input leakage current		0 V ≤ V_IN ≤ 3.6 V	–1		1	μA
	Serial bus input capacitance		SCL		3	6	pF
	Serial bus input capacitance		SDA		4.6	9	pF
	Serial bus clock frequency			0.001		2.17	MHz
	Serial bus timeout			20	25	30	ms
DIGITAL INPUTS (A0, A1)
V_IH	High-level input voltage			0.9(V+)	(V+) + 0.3		V
V_IL	Low-level input voltage			–0.3		0.1(V+)	V
	Input leakage current		0 V ≤ V_IN ≤ 3.6 V	–1		1	μA
	Input capacitance				2.5	5	pF
DIGITAL OUTPUTS (THERM, ALERT/THERM2)
	Output-low sink current			6			mA
V_OL	Low-level output voltage		I_O = –6 mA		0.15	0.4	V
I_OH	High-level output leakage current		V_O = V+			1	μA
POWER SUPPLY
V+	Specified supply voltage range			1.7		3.6	V
I_Q	Quiescent current		Active conversion, local sensor		240	375	µA
			Active conversion, remote sensor		400	600
			Standby mode (between conversions)		15	35
			Shutdown mode, serial bus inactive		3	8
			Shutdown mode, serial bus active, f_S = 400 kHz		90
			Shutdown mode, serial bus active, f_S = 2.17 MHz		350
POR	Power-on reset threshold		Rising edge		1.2	1.55	V

7.6 Two-Wire Timing Requirements

At –40°C to 125°C and V+ = 1.7 V to 3.6 V, unless otherwise noted.

		FAST MODE		HIGH-SPEED MODE		UNIT
		MIN	MAX	MIN	MAX	UNIT
f_(SCL)	SCL operating frequency	0.001	0.4	0.001	2.17	MHz
t_(BUF)	Bus free time between stop and start condition	1300		160		ns
t_(HDSTA)	Hold time after repeated start condition. After this period, the first clock is generated.	600		160		ns
t_(SUSTA)	Repeated start condition setup time	600		160		ns
t_(SUSTO)	Stop condition setup time	600		160		ns
t_(HDDAT)	Data hold time	0	900	0	150	ns
t_(SUDAT)	Data setup time	100		40		ns
t_(LOW)	SCL clock low period	1300		320		ns
t_(HIGH)	SCL clock high period	600		60		ns
t_F – SDA	Data fall time		300		130	ns
t_F, t_R – SCL	Clock fall and rise time		300		40	ns
t_R	Rise time for SCL ≤ 100 kHz		1000			ns