ZHCSH87B September   2017  – February 2020 TMP461-SP

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
   1.     簡化框圖
3. 3 說明
4. 4 修訂歷史記錄
5. 5 Pin Configuration and Functions
   1.     Pin Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 Two-Wire Timing Requirements
   7. 6.7 Typical Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
         1. 7.3.1.1 Standard Binary to Decimal Temperature Data Calculation Example
         2. 7.3.1.2 Standard Decimal to Binary Temperature Data Calculation Example
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Filtering
      5. 7.3.5 Sensor Fault
      6. 7.3.6 ALERT and THERM Functions
   4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
   5. 7.5 Programming
      1. 7.5.1 Serial Interface
         1. 7.5.1.1 Bus Overview
         2. 7.5.1.2 Bus Definitions
         3. 7.5.1.3 Serial Bus Address
         4. 7.5.1.4 Read and Write Operations
         5. 7.5.1.5 Timeout Function
         6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 General-Call Reset
   6. 7.6 Register Map
      1. 7.6.1 Register Information
         1. 7.6.1.1  Pointer Register
         2. 7.6.1.2  Local and Remote Temperature Registers
         3. 7.6.1.3  Status Register
         4. 7.6.1.4  Configuration Register
         5. 7.6.1.5  Conversion Rate Register
         6. 7.6.1.6  One-Shot Start Register
         7. 7.6.1.7  Channel Enable Register
         8. 7.6.1.8  Consecutive ALERT Register
         9. 7.6.1.9  η-Factor Correction Register
         10. 7.6.1.10 Remote Temperature Offset Register
         11. 7.6.1.11 Manufacturer Identification Register
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
   3. 8.3 Radiation Environments
      1. 8.3.1 Single Event Latch-Up
      2. 8.3.2 Single Event Functional Interrupt
      3. 8.3.3 Single Event Upset
9. 9 Power Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
11. 11器件和文檔支持
    1. 11.1 接收文檔更新通知
    2. 11.2 社區(qū)資源
    3. 11.3 商標(biāo)
    4. 11.4 靜電放電警告
    5. 11.5 Glossary
12. 12機(jī)械、封裝和可訂購信息