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ZHCSB68A June 2013 – December 2014 TMP451

PRODUCTION DATA.

封裝選項

機械數據 (封裝 | 引腳)

DQF|8
- MPSS009B

散熱焊盤機械數據 (封裝 | 引腳)

訂購信息

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range, unless otherwise noted.⁽¹⁾

		MIN	MAX	UNIT
Power supply	V+	–0.3	3.6	V
Input voltage	THERM, ALERT/THERM2, SDA and SCL only	–0.3	3.6	V
	D+ only	–0.3	(V+) + 0.3	V
	D– only	–0.3	0.3	V
Input current			10	mA
Operating temperature		–55	127	°C
Junction temperature (T_Jmax)			150	°C
T_stg	Storage temperature	–60	150	°C

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

6.2 ESD Ratings

			VALUE		UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾	±2000		V
V_(ESD)	Electrostatic discharge	Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾	±750		V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

		MIN	NOM	MAX	UNIT
	Supply voltage	1.7	3.3	3.6	V
T_A	Operating free-air temperature	–40		125	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TMP451	UNIT
		DQF
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	171.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	81.4
R_θJB	Junction-to-board thermal resistance	137.9
ψ_JT	Junction-to-top characterization parameter	3.9
ψ_JB	Junction-to-board characterization parameter	140

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

At T_A = –40°C to 125°C and V+ = 3.3 V, unless otherwise noted.

PARAMETER		CONDITIONS	MIN	TYP	MAX	UNIT
TEMPERATURE ERROR
TE_LOCAL	Local temperature sensor	T_A = 0°C to 70°C		±0.25	±1	°C
TE_LOCAL	Local temperature sensor	T_A = –40°C to 125°C		±1	±2	°C
TE_REMOTE	Remote temperature sensor⁽¹⁾	T_A = 0°C to 70°C, T_D = –55°C to 150°C		±0.25	±1	°C
		T_A = –40°C to 100°C, T_D = –55°C to 150°C		±1	±2	°C
		T_A = –40°C to 125°C, T_D = –55°C to 150°C		±2	±4	°C
	Remote temperature sensor versus supply (local or remote)	V+ = 1.7 V to 3.6 V		±0.1	±0.25	°C/V
TEMPERATURE MEASUREMENT
	Conversion time	One-Shot mode, local and remote total		31	34	ms
	Local temperature sensor resolution			12		Bits
	Remote temperature sensor resolution			12		Bits
	Remote sensor source current, high	Series resistance 1 kΩ max		120		μA
	Remote sensor source current, medium			45		μA
	Remote sensor source current, low			7.5		μA
η	Remote transistor ideality factor	TMP451 optimized ideality factor		1.008
SMBus INTERFACE
V_IH	High-level input voltage		1.4			V
V_IL	Low-level input voltage				0.45	V
	Hysteresis			200		mV
	SMBus output low sink current		6			mA
V_OL	Low-level output voltage	I_O = 6 mA		0.15	0.4	V
	Logic input current	0 V ≤ V_I ≤ 3.6 V	–1		1	μA
	SMBus input capacitance			3		pF
	SMBus clock frequency		0.01		2.5	MHz
	SMBus time-out		20	25	30	ms
	SCL falling edge to SDA valid time				1	μs
DIGITAL OUTPUTS (THERM, ALERT/THERM2)
V_OL	Low-level output voltage	I_O = 6 mA		0.15	0.4	V
I_OH	High-level output leakage current	V_O = V+			1	μA
POWER SUPPLY
V_(V+)	Specified voltage range		1.7		3.6	V
I_Q	Quiescent current	0.0625 conversions per second		27	40	μA
		16 conversions per second		165	250	μA
		32 conversions per second		300	450	μA
		Serial bus inactive, shutdown mode		3	8	μA
		Serial bus active, ƒ_S = 400 kHz, shutdown mode		90		μA
		Serial bus active, ƒ_S = 2.5 MHz, shutdown mode		350		μA
POR	Power-on reset threshold			1.2	1.55	V

(1) Tested with less than 5-Ω effective series resistance and 100-pF differential input capacitance.

6.6 Timing Requirements

PARAMETER		FAST MODE			HIGH-SPEED MODE			UNIT
PARAMETER		MIN	TYP	MAX	MIN	TYP	MAX	UNIT
ƒ_(SCL)	SCL operating frequency	0.001		0.4	0.001		2.5	MHz
t_(BUF)	Bus free time between STOP and START Condition	1300			260			ns
t_(HDSTA)	Hold time after repeated START condition. After this period, the first clock is generated.	600			160			ns
t_(SUSTA)	Repeated START condition setup time	600			160			ns
t_(SUSTO)	STOP condition setup time	600			160			ns
t_(HDDAT)	Data hold time	0		900	0		150	ns
t_(SUDAT)	Data setup time	100			30			ns
t_(LOW)	SCL clock LOW period	1300			260			ns
t_(HIGH)	SCL clock HIGH period	600			60			ns
t_F, t_R – SDA	Data fall and rise time			300			80	ns
t_F, t_R – SCL	Clock fall and rise time			300			40	ns
t_R	Rise time for SCL ≤ 100 kHz			1000				ns