ZHCSH80E September 2017 – May 2019 TMP235 , TMP236
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
6.6 Typical Characteristics
at TA = 25°C, (unless otherwise noted)
| TMP235: VDD = 2.3 to 5.5 V, IOUT = 0 µA, CLOAD = 1000 pF |
| IOUT = 0 µA, CLOAD = 1000 pF |
| TMP235: IOUT = 0 µA, CLOAD = 1000 pF |
| TMP235: VDD = 2.3 to 5.5 V, IOUT = 0 µA, CLOAD = 1000 pF |
| TMP235: TA = 25°C |
| TMP235: 1 × 1 (inches) PCB, Air 26°C to Fluid Bath 123°C |
| TMP235: VDD = 2.3 to 5.5 V, IOUT = 0 µA, CLOAD = 1000 pF |
| TMP235: IOUT = from 0 µA to 100 µA, CLOAD = 1000 pF |
| TMP235: VDD = 2.3 V, CLOAD = 1000 pF |
| TMP235: TA = 25°C |
| TMP235: TA = 25°C, VDD Ramp Rate = 5 V/ms |
| TMP235: TA = 25°C, VDD = 5 V, IOUT = 100 µA |