ZHCSHX1E March 2018 – August 2021 TMP1075
PRODUCTION DATA
| THERMAL METRIC(1) | TMP1075 | TMP1075 | TMP1075 | TMP1075N | UNIT | |
|---|---|---|---|---|---|---|
| DGK (VSSOP) | D (SOIC) | DSG (WSON) | DRL (SOT) | |||
| 8 PINS | 8 PINS | 8 PINS | 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 202.5 | 130.4 | 87.4 | 210.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 82 | 76.9 | 111.1 | 105.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 124.4 | 72.3 | 54 | 87.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 17.9 | 32 | 9.8 | 6.1 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 122.6 | 71.9 | 54.4 | 87.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | __ | __ | 28.1 | __ | °C/W |
| MT | Thermal mass | 16.6 | 64.2 | 5.0 | __ | mJ/°C |