ZHCSQR8A March   2023  – December 2023 TMAG5170D-Q1

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 應(yīng)用
4. 3 說(shuō)明
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1 Absolute Maximum Ratings
   2. 5.2 ESD Ratings
   3. 5.3 Recommended Operating Conditions
   4. 5.4 Thermal Information
   5. 5.5 Electrical Characteristics
   6. 5.6 Magnetic Characteristics
   7. 5.7 Power up Timing
   8. 5.8 SPI Interface Timing
   9. 5.9 Typical Characteristics
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Feature Description
      1. 6.3.1 Magnetic Flux Direction
      2. 6.3.2 Sensor Location
      3. 6.3.3 Magnetic Range Selection
      4. 6.3.4 Update Rate Settings
      5. 6.3.5 ALERT Function
         1. 6.3.5.1 Interrupt and Trigger Mode
         2. 6.3.5.2 Magnetic Switch Mode
      6. 6.3.6 Threshold Count
      7. 6.3.7 Diagnostics
         1. 6.3.7.1  Memory Cyclic Redundancy Check (CRC)
         2. 6.3.7.2  ALERT Integrity Check
         3. 6.3.7.3  VCC Check
         4. 6.3.7.4  Internal LDO Undervoltage Check
         5. 6.3.7.5  Digital Core Power-On Reset Check
         6. 6.3.7.6  SDO Output Check
         7. 6.3.7.7  Communication Cyclic Redundancy Check (CRC)
         8. 6.3.7.8  Oscillator Integrity Check
         9. 6.3.7.9  Magnetic Field Threshold Check
         10. 6.3.7.10 Temperature Alert Check
         11. 6.3.7.11 Analog Front-End (AFE) Check
         12. 6.3.7.12 Hall Resistance and Switch Matrix Check
         13. 6.3.7.13 Hall Offset Check
         14. 6.3.7.14 ADC Check
   4. 6.4 Device Functional Modes
      1. 6.4.1 Operating Modes
         1. 6.4.1.1 Active Mode
         2. 6.4.1.2 Standby Mode
         3. 6.4.1.3 Configuration Mode (DEFAULT)
         4. 6.4.1.4 Sleep Mode
         5. 6.4.1.5 Wake-Up and Sleep Mode
         6. 6.4.1.6 Deep-Sleep Mode
   5. 6.5 Programming
      1. 6.5.1 Data Definition
         1. 6.5.1.1 Magnetic Sensor Data
         2. 6.5.1.2 Temperature Sensor Data
         3. 6.5.1.3 Magnetic Sensor Offset Correction
         4. 6.5.1.4 Angle and Magnitude Data Definition
      2. 6.5.2 Serial Peripheral Interface (SPI)
         1. 6.5.2.1 SCK
         2. 6.5.2.2 CS
         3. 6.5.2.3 SDI
         4. 6.5.2.4 SDO
            1. 6.5.2.4.1 Regular 32-Bit SDO Read
            2. 6.5.2.4.2 Special 32-Bit SDO Read
         5. 6.5.2.5 SPI CRC
         6. 6.5.2.6 SPI Frame
            1. 6.5.2.6.1 32-Bit Read Frame
            2. 6.5.2.6.2 32-Bit Write Frame
8. 7 Application and Implementation
   1. 7.1 Application Information
      1. 7.1.1 Selecting the Sensitivity Option
      2. 7.1.2 Temperature Compensation for Magnets
      3. 7.1.3 Sensor Conversion
         1. 7.1.3.1 Continuous Conversion
         2. 7.1.3.2 Trigger Conversion
         3. 7.1.3.3 Pseudo-Simultaneous Sampling
      4. 7.1.4 Error Calculation During Linear Measurement
      5. 7.1.5 Error Calculation During Angular Measurement
   2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
         1. 7.2.1.1 Gain Adjustment for Angle Measurement
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
   3. 7.3 Best Design Practices
   4. 7.4 Power Supply Recommendations
   5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
9. 8 Register Map
10. 9 Device and Documentation Support
    1. 9.1 接收文檔更新通知
    2. 9.2 支持資源
    3. 9.3 Trademarks
    4. 9.4 靜電放電警告
    5. 9.5 術(shù)語(yǔ)表
11. 10Revision History
12. 11Mechanical, Packaging, and Orderable Information