ZHCSUZ6B February 2024 – May 2024 TLV9051-Q1 , TLV9052-Q1
PRODMIX
| THERMAL METRIC(1) | TLV9051-Q1 | UNIT | ||
|---|---|---|---|---|
| DBV (SOT-23) |
DCK (SC70) |
|||
| 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 232.5 | TBD | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 131.0 | TBD | °C/W |
| RθJB | Junction-to-board thermal resistance | 99.6 | TBD | °C/W |
| ψJT | Junction-to-top characterization parameter | 66.5 | TBD | °C/W |
| ψJB | Junction-to-board characterization parameter | 99.1 | TBD | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |