ZHCSG36D December 2016 – November 2017 TLV8541 , TLV8542 , TLV8544
UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
| THERMAL METRIC(1) | TLV8544 | TLV8542 | TLV8541 | UNIT | |
|---|---|---|---|---|---|
| PW (TSSOP) | D (SOIC) | DBV (SOT-23) | |||
| 14 PINS | 8 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 124.5 | 141.6 | 244.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 52.7 | 85.7 | 127.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 66.2 | 84.7 | 79.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 7.3 | 36.3 | 44.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 65.7 | 84.0 | 78.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |