ZHCSL29A April 2020 – December 2020 TLV767-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TLV767-Q1 | UNIT | |
|---|---|---|---|
| DRB (VSON) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 51.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 66.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 24.4 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 2.7 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 24.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 6.9 | °C/W |