ZHCSKJ1A December 2019 – February 2020 TLV751
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV751P | UNIT | |
|---|---|---|---|
| DSQ (WSON) | |||
| 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 74.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 90.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 39.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 39.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 17 | °C/W |