ZHCSGV4J September 2017 – November 2024 TLV7031 , TLV7032 , TLV7034 , TLV7041 , TLV7042 , TLV7044
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Thermal Information (Single)
- 5.5 Thermal Information (Dual)
- 5.6 Thermal Information (Quad)
- 5.7 Electrical Characteristics (Single)
- 5.8 Switching Characteristics (Single)
- 5.9 Electrical Characteristics (Dual)
- 5.10 Switching Characteristics (Dual)
- 5.11 Electrical Characteristics (Quad)
- 5.12 Switching Characteristics (Quad)
- 5.13 Timing Diagrams
- 5.14 Typical Characteristics
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RTE|16
訂購(gòu)信息
7.4.2 Layout Example
Figure 7-13 Layout ExampleThe application report Designing and Manufacturing With TI's X2SON Packages (SCEA055) helps PCB designers to achieve optimal designs.