ZHCSPJ4F September 2010 – March 2023 TLV704
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | Legacy Chip | New Chip | UNIT | |
|---|---|---|---|---|
| DBV (SOT-23) | DBV (SOT-23) | |||
| 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 213.1 | 170.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 110.9 | 68.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 97.4 | 76.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 22.0 | 10.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 78.4 | 76.3 | °C/W |