ZHCSI23B April 2018 – March 2020 TLV62568A , TLV62569A
PRODUCTION DATA.
| THERMAL METRIC (1) | TLV62568Ax, TLV62569Ax | UNIT | ||
|---|---|---|---|---|
| JEDEC (DRL) | EVM (DRL) | |||
| 6 PINS | 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 142.8 | 124.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 51.1 | n/a (2) | °C/W |
| RθJB | Junction-to-board thermal resistance | 28.9 | n/a (2) | °C/W |
| ΨJT | Junction-to-top characterization parameter | 1.4 | 1.6 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 28.7 | 23.1 | °C/W |