ZHCSFQ3B November 2016 – November 2017 TLV62568
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機械、封裝和可訂購信息
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
6 Specifications
6.1 Absolute Maximum Ratings
Over operating temperature range (unless otherwise noted)(1)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Voltage(2) | VIN, EN, PG | –0.3 | 6 | V |
| SW (DC) | –0.3 | VIN+0.3 | V | |
| SW (AC, less than 10 ns)(3) | –3.0 | 9 | V | |
| FB | –0.3 | 5.5 | V | |
| Operating junction temperature, TJ | –40 | 150 | °C | |
| Storage temperature, Tstg | –65 | 150 | °C | |
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) While switching.
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 | V | ||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions(1)
| MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|
| VIN | Input voltage | 2.5 | 5.5 | V | |
| VOUT | Output voltage | 0.6 | VIN | V | |
| IOUT | Output current | 1 | A | ||
| TJ | Operating junction temperature | –40 | 125 | °C | |
| ISINK_PG | Sink current at PG pin | 1 | mA |
(1) Refer to the Application and Implementation section for further information.
6.4 Thermal Information
| THERMAL METRIC(1) | DBV (5 Pins) |
DDC (6 pins) |
DRL (6 pins) |
UNIT | |
|---|---|---|---|---|---|
| RθJA | Junction-to-ambient thermal resistance | 191.6 | 121.6 | 149.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 141.4 | 69.1 | 45.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 44.5 | 45.5 | 31.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 34.5 | 22.3 | 1.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 43.9 | 46.0 | 31.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.5 Electrical Characteristics
VIN = 5 V, TJ = 25°C, unless otherwise noted6.6 Typical Characteristics
1.
Figure 3. FB Voltage Accuracy
1.
Figure 2. Shutdown Current vs Junction Temperature