ZHCSHJ3F March 2001 – August 2016 TLV2370 , TLV2371 , TLV2372 , TLV2373 , TLV2374 , TLV2375
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Device Comparison Tables
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Typical Characteristics
- 9 Detailed Description
- 10Application and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13器件和文檔支持
- 14機(jī)械、封裝和可訂購信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
12.3 Power Dissipation Considerations
For a given θJA value, the maximum power dissipation is shown in Figure 41 and is calculated by Equation 4:
Equation 4. 
where
- PD = Maximum power dissipation of TLV237x IC (watts)
- TMAX = Absolute maximum junction temperature (150°C)
- TA = Free-ambient air temperature (°C)
- θJA = θJC (Thermal coefficient from junction to case) + θCA (Thermal coefficient from case to ambient air (°C/W))
Results are with no air flow and using JEDEC Standard Low-K test PCB.
Figure 41. Maximum Power Dissipation vs Free-Air Temperature