ZHCSHJ3F March 2001 – August 2016 TLV2370 , TLV2371 , TLV2372 , TLV2373 , TLV2374 , TLV2375
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV2370 | UNIT | |||
|---|---|---|---|---|---|
| DBV (SOT-23) | D (SOIC) | P (PDIP) | |||
| 6 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 228.5 | 138.4 | 49.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 99.1 | 89.5 | 39.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 54.6 | 78.6 | 26.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 7.7 | 29.9 | 15.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 53.8 | 78.1 | 26.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | °C/W |