ZHCSLZ2B October 2022 – September 2023 TLV1811-Q1 , TLV1812-Q1 , TLV1814-Q1 , TLV1821-Q1 , TLV1822-Q1 , TLV1824-Q1
PRODMIX
| THERMAL METRIC(1) | TLV18x4-Q1 | UNIT | ||||
|---|---|---|---|---|---|---|
| D (SOIC) | PW (TSSOP) | DYY (SOT-23) | RTE (WQFN) | |||
| 14 PINS | 14 PINS | 14 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 104.2 | 124.1 | 119.9 | 53.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 60.3 | 52.4 | 60.6 | 58.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 60.2 | 67.2 | 79.0 | 29.0 | °C/W |
| ψJT | Junction-to-top characterization parameter | 20.7 | 7.5 | 3.3 | 2.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 59.8 | 66.6 | 41.2 | 28.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | – | – | – | 13.1 | °C/W |