ZHCSLG4B July 2020 – May 2022 TLIN1027-Q1
PRODUCTION DATA
| THERMAL METRIC(1) |
TLIN1027D
|
TLIN1027DRB
|
UNIT | |
|---|---|---|---|---|
| D (SOIC) | DRB (VSON) | |||
| 8-PINS | 8-PINS | |||
| RΘJA | Junction-to-ambient thermal resistance | 115.5 | 48.5 | °C/W |
| RΘJC(top) | Junction-to-case (top) thermal resistance | 58.7 | 55.5 | °C/W |
| RΘJB | Junction-to-board thermal resistance | 58.9 | 22.2 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 14.1 | 1.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 58.2 | 22.2 | °C/W |
| RΘJC(bot) | Junction-to-case (bottom) thermal resistance | - | 4.8 | °C/W |