ZHCSI07D April 2018 – June 2022 TLIN1024-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | RGY (VQFN) | UNIT | |
|---|---|---|---|
| 24-PINS | |||
| RΘJA | Junction-to-ambient thermal resistance | 34.3 | °C/W |
| RΘJC(top) | Junction-to-case (top) thermal resistance | 30.8 | °C/W |
| RΘJB | Junction-to-board thermal resistance | 13.3 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 13.3 | °C/W |
| RΘJC(bot) | Junction-to-case (bottom) thermal resistance | 2.8 | °C/W |