ZHCSIG2A July 2018 – August 2018 TLC6C5716-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | TLC6C5716-Q1 | UNIT | |
|---|---|---|---|
| DAP (HTSSOP) | |||
| 38 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 39.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 31.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 18.0 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 18.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.0 | °C/W |