SBVS146D August 2010 – December 2015 TLC5971
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parametric Measurement Information
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3 Feature Description
- 8.4 Device Functional Modes
- 8.5 Programming
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
11 Layout
11.1 Layout Guidelines
- Place the decoupling capacitor near the VCC pin and GND plane.
- Route the GND pattern as widely as possible for large GND currents.
- Connecting wire between the chained ICs should be as short as possible to reduce wire inductance.
11.2 Layout Example
Figure 40. Layout Example