SLDS157E February 2008 – December 2014 TLC59116
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Description (continued)
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Parameter Measurement Information
-
9 Detailed Description
- 9.1 Overview
- 9.2 Functional Block Diagram
- 9.3 Feature Description
- 9.4 Device Functional Modes
- 9.5
Register Maps
- 9.5.1 Mode Register 1 (MODE1)"SLEEP" to "OSC" in Mode Register 1 (MODE1) Table.
- 9.5.2 Mode Register 2 (MODE2)
- 9.5.3 Brightness Control Registers 0 to 15 (PWM0 to PWM15)
- 9.5.4 Group Duty Cycle Control Register (GRPPWM)
- 9.5.5 Group Frequency Register (GRPFREQ)
- 9.5.6 LED Driver Output State Registers 0 to 3 (LEDOUT0 to LEDOUT3)
- 9.5.7 I2C Bus Subaddress Registers 1 to 3 (SUBADR1 to SUBADR3)
- 9.5.8 LED All Call I2C Bus Address Register (ALLCALLADR)
- 9.5.9 Output Gain Control Register (IREF)
- 9.5.10 Error Flags Registers (EFLAG1, EFLAG2)
- 9.5.11 Control Register
-
10Application and Implementation
- 10.1 Application Information
- 10.2 Typical Application
- 11Power Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
- RHB|32
訂購信息
13 Device and Documentation Support
13.1 Trademarks
All other trademarks are the property of their respective owners.
13.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
13.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.