ZHCSI82E May 2018 – May 2019 THVD1410 , THVD1450 , THVD1451 , THVD1452
PRODUCTION DATA.
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | THVD1410
THVD1450 THVD1451 |
THVD1452 | THVD1410
THVD1450 |
THVD1452 | THVD1450
THVD1451 |
UNIT | |
|---|---|---|---|---|---|---|---|
| D (SOIC) | D (SOIC) | DGK (VSSOP) | DGS (VSSOP) | DRB (VSON) | |||
| 8 PINS | 14 PINS | 8 PINS | 10 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 114.3 | 86.4 | 155.2 | 155.6 | 48.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 56.7 | 43.7 | 47.2 | 49.3 | 49.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 57.7 | 42.5 | 76.1 | 77.1 | 21.1 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 12.8 | 10.2 | 3.9 | 4.5 | 0.8 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 57 | 42.2 | 74.8 | 75.7 | 21.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A | 2.7 | °C/W |