ZHCSPA5F August 1999 – July 2024 THS4021 , THS4022
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | THS4021 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DGN (HVSSOP) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 124.5 | 58.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 65.0 | 4.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 72.2 | N/A | °C/W |
| ΨJT | Junction-to-top characterization parameter | 13.6 | N/A | °C/W |
| ΨJB | Junction-to-board characterization parameter | 71.4 | N/A | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |