ZHCSEG6F December 2015 – May 2025 TCAN330 , TCAN330G , TCAN332 , TCAN332G , TCAN334 , TCAN334G , TCAN337 , TCAN337G
PRODUCTION DATA
| THERMAL METRIC(1) | TCAN33x | TCAN33x | UNIT | ||
|---|---|---|---|---|---|
| D (SOIC) | DCN (SOT-23) | ||||
| 8 PINS | 8 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 114.4 | 154.4 | °C/W | |
| RθJC(top) | Junction-to-case (top) thermal resistance | 58.7 | 76.6 | °C/W | |
| RθJB | Junction-to-board thermal resistance | 55.2 | 49.2 | °C/W | |
| ψJT | Junction-to-top characterization parameter | 11.7 | 11.9 | °C/W | |
| ψJB | Junction-to-board characterization parameter | 54.6 | 49.2 | °C/W | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W | |
| PD | Average power dissipation | VCC = 3.3 V, TJ = 27°C, RL = 60 ?, SHDN, S and STB at 0 V, Input to TXD at 500 kHz, 50% duty cycle square wave, CL(RXD) = 15 pF | 65 | 65 | mW |
| TSD | Thermal shutdown temperature | 175 | 175 | °C | |
| THYS | Thermal shutdown hysteresis | 5 | 5 | °C | |