ZHCSCU3C January   2014  – September 2019 TCA5013

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說明
   1.     Device Images
      1.      簡化原理圖
4. 4 修訂歷史記錄
5. 5 Pin Configuration and Functions
   1.     Pin Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Handling Ratings
   3. 6.3  Recommended Operating Conditions
   4. 6.4  Thermal Information
   5. 6.5  Electrical Characteristics—Power Supply and ESD
   6. 6.6  Electrical Characteristics—Card VCC
   7. 6.7  Electrical Characteristics—Card RST
   8. 6.8  Electrical Characteristics—Card CLK
   9. 6.9  Electrical Characteristics—Card Interface IO, C4 and C8
   10. 6.10 Electrical Characteristics—PRES
   11. 6.11 Electrical Characteristics—IOMC1 and IOMC2
   12. 6.12 Electrical Characteristics—CLKIN1 and CLKIN2
   13. 6.13 Electrical Characteristics—A0 and SHDN
   14. 6.14 Electrical Characteristics—INT
   15. 6.15 Electrical Characteristics—GPIO
   16. 6.16 Electrical Characteristics—SDA and SCL
   17. 6.17 Electrical Characteristics—Fault Condition Detection
   18. 6.18 I2C Interface Timing Requirements
   19. 6.19 I2C Interface Timing Characteristics
   20. 6.20 Synchronous Type 1 Card Activation Timing Characteristics
   21. 6.21 Synchronous Type 2 Card Activation Timing Characteristics
   22. 6.22 Card Deactivation Timing Characteristics
   23. 6.23 Typical Characteristics
7. 7 Parameter Measurement Information
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Card Interface Modules
      2. 8.3.2 SAM Card Interface Modules
      3. 8.3.3 User Card Interface Module
      4. 8.3.4 Clock Division and Multiplexing
      5. 8.3.5 IO Multiplexing
      6. 8.3.6 GPIO Operation
      7. 8.3.7 Power Management Features
      8. 8.3.8 ESD Protection
      9. 8.3.9 I2C interface
   4. 8.4 Device Functional Modes
      1. 8.4.1  Power Off Mode
      2. 8.4.2  Shutdown Mode
      3. 8.4.3  Standby Mode
      4. 8.4.4  Active Mode
         1. 8.4.4.1 User Card Operating Mode Selection
         2. 8.4.4.2 Synchronous Type 1 Operating Mode
         3. 8.4.4.3 Synchronous Type 2 Operating Mode
         4. 8.4.4.4 Manual Operating Mode
         5. 8.4.4.5 Asynchronous Operating Mode
         6. 8.4.4.6 Warm Reset Sequence
         7. 8.4.4.7 Deactivation Sequence
      5. 8.4.5  User Card Insertion / Removal Detection
      6. 8.4.6  IO Operation
         1. 8.4.6.1 IO Switching Control
         2. 8.4.6.2 IO Rise Time and Fall Time control
         3. 8.4.6.3 Current Limiting on IO Pin
      7. 8.4.7  CLK Operation
         1. 8.4.7.1 CLK Switching
         2. 8.4.7.2 CLK Rise Time and Fall Time Control
         3. 8.4.7.3 Current Limiting On CLK Pin
      8. 8.4.8  RST Operation
         1. 8.4.8.1 Current Limiting On RST
      9. 8.4.9  Interrupt Operation
         1. 8.4.9.1  Card Insertion And Removal
         2. 8.4.9.2  Over Current Fault
         3. 8.4.9.3  Supervisor Fault
         4. 8.4.9.4  Over Temperature Fault
         5. 8.4.9.5  EARLY Fault
         6. 8.4.9.6  MUTE Fault
         7. 8.4.9.7  Synchronous Activation Complete
         8. 8.4.9.8  VCC Ramp Fault
         9. 8.4.9.9  GPIO Input State Transition
         10. 8.4.9.10 POR Interrupt
      10. 8.4.10 Power Management
          1. 8.4.10.1 Voltage Supervisor
          2. 8.4.10.2 DC-DC Boost
          3. 8.4.10.3 LDOs and Load Transient Response
   5. 8.5 Programming
      1. 8.5.1 I2C Interface Operation
         1. 8.5.1.1 I2C Read and Write Procedures
         2. 8.5.1.2 I2C Address Configuration
   6. 8.6 Register Maps
      1. 8.6.1 Memory Map
         1. Table 12. 91
         2. Table 13. 92
         3. Table 14. 93
         4. Table 15. 94
         5. Table 16. 95
         6. Table 17. 96
         7. Table 18. 97
         8. Table 19. 98
         9. Table 20. 99
         10. Table 21. 100
         11. Table 22. 101
         12. Table 23. 102
         13. Table 24. 103
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
         1. 9.2.2.1 IO Pin Fall Time Setting
         2. 9.2.2.2 CLK Pin Rise Time And Fall Time Settings
      3. 9.2.3 Application Curves
10. 10Power Supply Recommendations
    1. 10.1 Power-On-Reset
11. 11Layout
    1. 11.1 Layout Guidelines
       1. 11.1.1 DC-DC Boost Layout Recommendation
       2. 11.1.2 Card Interface Layout Recommendations
    2. 11.2 Layout Example
12. 12器件和文檔支持
    1. 12.1 商標(biāo)
    2. 12.2 靜電放電警告
    3. 12.3 Glossary
13. 13機(jī)械、封裝和可訂購信息