ZHCSV36E September 2003 – December 2024 SN74LVC32A-Q1
PRODUCTION DATA
- 1
- 1 特性
- 2 說明
- 3 Pin Configuration and Functions
- 4 Specifications
- 5 Parameter Measurement Information
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機械數(shù)據(jù) (封裝 | 引腳)
- D|14
- PW|14
- BQA|14
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- BQA|14
訂購信息
3 Pin Configuration and Functions
Figure 3-1 D or PW Package, 14-Pin SOIC or TSSOP (Top View)
Figure 3-2 SN74LVC32A-Q1 BQA Package, 14-PIN WQFN (Top View)Table 3-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| 1A | 1 | I | Channel 1, Input A |
| 1B | 2 | I | Channel 1, Input B |
| 1Y | 3 | O | Channel 1, Output Y |
| 2A | 4 | I | Channel 2, Input A |
| 2B | 5 | I | Channel 2, Input B |
| 2Y | 6 | O | Channel 2, Output Y |
| GND | 7 | — | Ground |
| 3Y | 8 | O | Channel 3, Output Y |
| 3A | 9 | I | Channel 3, Input A |
| 3B | 10 | I | Channel 3, Input B |
| 4Y | 11 | O | Channel 4, Output Y |
| 4A | 12 | I | Channel 4, Input A |
| 4B | 13 | I | Channel 4, Input B |
| VCC | 14 | — | Positive Supply |
| Thermal Information(2) | — | The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply. | |
(1) Signal Types: I = Input, O = Output, I/O
= Input or Output, P = Power Supply, G = Ground.
(2) For BQA package only.