SCLS800A March 2020 – June 2020 SN74HCS30
PRODUCTION DATA.
| THERMAL METRIC(1) | SN74HCS30 | UNIT | ||
|---|---|---|---|---|
| PW (TSSOP) | D (SOIC) | |||
| 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 151.7 | 133.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 79.4 | 89.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 94.7 | 89.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 25.2 | 45.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 94.1 | 89.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |